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Next Generation KGD Memory Test Achieved Wafer Level Speed Beyond 3 GHz/6 Gbps

Recent industry wide adoption of heterogeneous integrated system enabled by 2.5D and 3D advanced packaging technology is driving up the demand for known-good-die. Coupled with the advancement on DRAM and High Bandwidth Memory (HBM) native speed capability, the latest memory is running beyond 2 GHz (4 Gbps) which is pushing the limit on existing ATE testers. Recent joint effort between SK Hynix, FormFactor and Advantest successfully demonstrated that beyond 3 GHz is achievable. This session discusses the design challenges overcame in this collaboration from a system level signal integrity and power delivery perspective.

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