Ultra High Temperature Probe Card Solution for Automotive IC Testing

In this paper, we discuss overall industry trend of automotive IC growth and technology trends, wafer test challenges and FromFactor’s solution to enable massive parallel testing of >=128 DUT parallel test on automotive micro-controller device, from -40C to 160C. We will also share extensive engineering characterization results on prober deflection and thermal behavior, high pin count probe card AOT vs. POT, low force MEMS probe on wafer pad to achieve zero defect IC wafer probing requirements.

Created: November 5, 2019 | Updated: June 25, 2020 | Type: pdf | Size: 1.46 MB

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