Cascade
Chucks
Non-thermal and thermal chucks
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Chucks and Thermal Systems
All FormFactor wafer probe stations are fully integrated with an exclusively developed non-thermal chuck or a highly-reliable thermal chuck system from ATT. Depending on your application, temperature range and performance requirements we offer a large variety of thermal systems from -60°C to 300°C, ranging from the most powerful and fastest high-performance systems in the market to extremely economic systems providing the best cost-performance ratio you can get.
All our systems are nickel or gold-plated and guarantee superior electrical performance. Our patented MicroVac™ and FemtoGuard™ technologies provide advanced measurement accuracy and ultra-low wafer contact resistance, even for warped/thin wafers.
The modular concept for convenient and cost effective system upgrades provides highest safety of investment and easy customization.
Full Thermal Range Systems (-60°C to 300°C)
- Most powerful and fastest high-performance systems for highly demanding requirements
- Shortest transition times in the market
- Optional ECO Mode for lower air consumption (CDA) than other systems in the market (365l/min)
Economic Thermal System (-40C° to 300°C)
- 25% lower air consumption (CDA) than other systems in the market (300l/min)
- Power Mode: 15% faster transition times than other systems in the market
- Best cost-performance ratio of systems with a wide thermal range
Hot-Only Systems (+20°C/+30°C to 300°C)
- Modular and field-upgradeable to cold (-40°C or -60°C): grows with your needs
- Controlled Ambient Technology (+20°C): Precise temperature control, even below ambient temperatures, with no need of an additional chiller
Besides our technology-leading coaxial and triaxial chuck systems, our portfolio is complemented with the following specialized chucks:
- RF/microwave chucks, equipped with up to three auxiliary chucks for holding calibration substrates and/or cleansing pads
- High-power chucks with Taiko wafer handling capability, an anti-arcing solution and an auto-discharging system for high throughput and measurement accuracy, while providing a regulatory-certified safe testing environment
- Double Side Chucks: Patented double side design can be configured to hold a variety of different substrate designs and sizes. Mainly used within emission microscopy systems, it can also be used to hold special substrates including MEMS dies held in square metal carriers.
*Chuck performance is specified in probe station Data Sheets.
Flexibility
- Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
- Temperatures range from -60°C to +300°C
- Surfaces are nickel or gold-plated
- Hybrid chuck design – operation with and without cooling unit
- Field-upgradeable: On-site cold upgrades for all main prober platforms
Highest Efficiency for Reduced Cost of Test
- Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
- Up to 15% faster transition times than other systems on the market
Low Thermal Resistance
- Low Thermal Resistance Technology
- MultiSense with multiple temperature sensors
- Best temperature accuracy and uniformity
Superior Electrical Performance
- Isolated from ground
- Includes a jack for grounding and biasing
- Highly planar chuck surface for consistant contact force and overtravel
Patented MicroVac™ Technology
- Advanced wafer vacuum system for warped/partial thin wafers
- Provides uniform vacuum across the entire wafer surface
- 495 micro-holes with 200 µm diameter patterned throughout the chuck
- Five user selectable vacuum zones: even partial wafers that do not cover all the chuck vacuum holes are held down with uniform vacuum
- Increased measurement accuracy with uniform device heat dissipation and ultra-low wafer contact resistance
Patented FemtoGuard™ Technology
- Advanced shielding technology
- Enables ultra-low noise, fully guarded measurements and controlled leakage
- Low residual capacitance for repeatability and advanced measurement accuracy and speed
IntelligentDry Air Control
- Active CDA purge control to reduce the dry air consumption
Auxiliary Chucks
- Dedicated RF chucks come with up to three auxiliary chucks for holding calibration substrates and/or cleansing pads
- Different materials available: Steel, Absorber, Ceramic
SourceOne – Certified Pre-Owned Equipment
You want the best price-performance ratio for your wafer probe station? With our Certified Used Equipment we have an attractive option for you.
SourceOne – Factory Refurbishment Program
Extend the use of your probe station for up to another 15 years with our Factory Refurbishment Program.
SourceOne – Trade In / Buy Back Program
We'll take your probe station back for a credit note.
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