Contact Us
Connect to an Expert

Looking for customer support? Ready to learn more about our products and services?

Contact Sales Today
HPD - PQ500 cryostat-agnostic, high-density RF and DC socket interface
  • HPD - PQ500 cryostat-agnostic, high-density RF and DC socket interface
  • HPD - PQ500 cryostat-agnostic, high-density RF and DC socket interface
  • HPD - PQ500 cryostat-agnostic, high-density RF and DC socket interface
  • HPD - PQ500 cryostat-agnostic, high-density RF and DC socket interface

The HPD PQ500, a first-of-its-kind, cryostat-agnostic, high-density RF and DC socket interface, enables researchers and developers to test chips without wire bonding and packaging. The cryogenic probe socket solution can be used at mK temperatures, adaptable to an existing cryostat, accommodating small pitches, and capable of having an extremely high channel capacity. 

  • Tests and validates performance directly on silicon without post-dicing packaging  
  • Dramatically reduces time to data and shortens development cycles  
  • Enables high scalability for high volume manufacturing  
  • Offers flexibility in chip design with full grid probing